Objectives . To evaluate the bond strength of etch-and-rinse adhesives in different solvent evaporation conditions.
Materials and methods . Flat dentin surfaces from thirty extracted human third molars were bonded with acid etching adhesives: (1) Scotch Bond Multi-Purpose (SBMP; 3M/ESPE) – water-based; (2) Single Bond (SB; 3M/ESPE) – ethanol/water based and Prime & Bond 2.1 (PB; Dentsply) – acetone-based. Bonded dentin surfaces were air-dried according manufacturer directions at either 21 °C or 38 °C. Composite buildups were constructed incrementally. After storage in water for 24 h at 37 °C, the specimens were prepared for microtensile bond strength testing. Data were analyzed by two-way ANOVA and Tukey test ( p < 0.05).
Results . SBMP performed better at a higher temperature ( p < 0.05). The higher temperatures did not affect the performance for SB and PB ( p > 0.05). The PB showed the highest bond strength values compared to SBMP and was similar to SB.
| Adhesive systems | Air-temperature (21°C) | Air-temperature (38°C) |
|---|---|---|
| SBMP | 33.5 ± 11.85, N = 32aB | 41.1 ± 16.47, N = 21bA |
| SB | 38.8 ± 14.95, N = 23aAB | 42.4 ± 17.27, N = 24aA |
| PB | 44.3 ± 15.60, N = 22aA | 51.8 ± 12.64, N = 29aA |
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