Objective : The overall goal of this research was to chemically modify the surface of zirconia dental ceramics with a Si x O y seed layer to increase adhesive bonding with commercially available silanes and resin cements.
Materials and methods : Investigation focused on a novel approach to functionalize the zirconia surface with Si x O y that would promote chemical bonding with traditional organo-silanes. Planar test structures were prepared, modified, and analyzed, before and after Si–O modification using X-ray photoelectron spectroscopy (XPS). Varying thicknesses of Si x O y were deposited on ZirCAD blocks and bonded to a similar dimension composite block. Microtensile bars were prepared and subjected to tensile forces, scanning electron microscopy (SEM) was used to analyze fracture surfaces and determine failure mode.
Results : XPS analysis revealed a level of bonded Si x O y to the surface of zirconia. Microtensile bond testing revealed that a thin (2.6 nm) Si x O y modification was similar in bond strength to the porcelain control group. Other groups tested had lower strength values and higher percentages of adhesive failures.
Group | Peak stress (SD) (MPa) | Adhesive (%) | Mixed mode (%) | Cohesive (%) |
---|---|---|---|---|
Composite (bars only) a | 29.2 (3.7) | Control | ||
Porcelain – (control) b | 25.3 (5.3) | 16 | 35 | 49 |
Zirconia (Si x Oy – 2.6 nm thickness) b | 23.2 (5.4) | 15 | 40 | 45 |
Zirconia (CoJet treatment) c | 18.6 (5.9) | 32 | 52 | 16 |
Zirconia (Si x O y – 23 nm thickness) c | 16.2 (5.9) | 50 | 43 | 7 |
Zirconia (no treatment) d | 7.6 (3.0) | 72 | 28 | – |